Name
Title | Citations | PageRank | Year |
|---|---|---|---|
| Wafer-level 3D integration with Cu TSV and micro-bump/adhesive hybrid bonding technologies | 2 | 0.54 | 2011 |
| Cu-based bonding technology for 3D integration applications. | 0 | 0.34 | 2011 |
| Wafer-level 3D integration using hybrid bonding. | 2 | 0.64 | 2010 |